EINDHOVEN, The Netherlands, Oct. 17, 2017 — NXP Semiconductors N.V. (NASDAQ:NXPI) today announced its new, ultra-thin contactless chip module that transforms how passport and identity cards are designed. Measuring just 200 μm thick – roughly four times the thickness of an average human hair – the MOB10 is 20 percent thinner than its predecessor and is ideally suited for use in ultra-thin inlays for passport data pages and identity cards. The MOB10 is the thinnest contactless module available in high volumes today and supports polycarbonate technology, along with new security and durability features. Additionally, the MOB10 is the first ultra-thin platform designed to be compatible with existing production lines so manufacturers can add it without retooling; allowing them to support multiple products without increasing costs or slowing down production.
The new ultra-thin MOB10 is designed to combat electronic document fraud by enabling slimmer and more secure eDatapages, eCovers and ID card inlays that are harder to forge or modify. The ultra-thin profile of 200 μm makes it possible to accommodate new security features and still include the secure microcontroller and its antenna without adding bulk to passports, national eID cards, eHealth cards, citizenship cards, resident cards, driver licenses, and smart cards. For passports, the MOB10 now allows the IC to be moved from the cover of the passport booklet to the personal data page within the inside of the passport. This new feature offers additional security by preventing attempts to peel off or re-insert the IC after tampering. Additionally, the MOB10 is designed to reduce micro-cracks, sustain mechanical and environmental stresses, and is less susceptible to reverse-engineering or other security attacks.
“We are experiencing increased demand for slimmer solutions that can meet the future embedding requirements needed to produce thinner, and more cost-effective identity documents,” said Sebastien Clamagirand, general manager of the secure identification business line at NXP. “As the world’s thinnest contactless chip module, the MOB10 is uniquely suited to answer this need and will empower a new generation of passports and ID cards that are thinner, more durable and even more secure than ever before.”
The MOB10 is designed for high volume and offers higher density per reel. This feature optimizes machine throughput and storage space, so manufacturers of identity documents can reduce cost, operate more efficiently, and deliver more resilient end products. To ensure flexibility in implementation, the MOB10 solution is compatible with ICAO 9303 and ISO/IEC 14443 standards.
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ:NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy, and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 31,000 employees in more than 33 countries and posted revenue of $9.5 billion in 2016. Find out more at www.nxp.com.
IDEMIA, G+D and NXP Launch WLA to Offer Smart Card and Online Payment Firms an Independent Contactless Payment Standard
March 11, 2021 -- MUNICH, Germany -- The White Label Alliance (WLA) was formed in response to increasing global demand for next-generation, independent payment solutions. WLA consolidates and sets independent standards for contact and contactless smart cards, mobile and other
July 18, 2020 -- NXP Semiconductors (NASDAQ:NXPI), Mastercard, and Xiaomi Inc. today announced they are bringing more convenient and secure contactless experiences to Russia as the first phase of a European-wide roll-out with NXP's mobile wallet solution. Powering mobile payments for
NXP Introduces MIFARE DESFire EV3 IC, Ushers In New Era of Security and Connectivity for Contactless Smart City Services
June 02, 2020 09:00 ET Service providers and end users can benefit from convenient and reliable contactless access and payment solutions Enhanced feature set increases security for smart city installations Mobile and multi-application support allow service providers to collaborate in
IRVINE, CA, October 11, 2019 – CardLogix is preparing clients for the official release of NXP’s latest generation Java Card OS, JCOP 4, smart cards with custom applet development and existing applet support. CardLogix helps software developers create applets
MELBOURNE, Australia, March 27, 2019 -- NXP Semiconductors N.V. (NASDAQ:NXPI) today announced that the Public Transport Victoria (PTV) network in Australia implemented NXP’s end-to-end MIFARE 2GO cloud service with Google Pay to take its myki transit card mobile. Deployed by
Nov 26, 2018 - NXP’s MIFARE Secure Access Module (SAM) architecture, now in its third generation, makes it easy to add security to the latest IoT applications. The new product comes with an extended feature set that supports product types inside the