Coil-on-Module

Coil on Module (CoM) is a packaging technology from Infineon that uses a radio frequency link instead of the mechanical/electrical connection typically used between the card antenna and the smart card module. This improves the robustness and long-term reliability of dual-interface (DIF) smart cards as well as ID documents and simplifies card design, manufacturing and logistics, making these processes more efficient and up to five times faster than with conventional technologies.

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