ROUSSET, FRANCE, March 5, 2012 – Smart Packaging Solutions expertise in dual-interface has been recognized again with 15 additional Visa and MasterCard certifications obtained in 2011. Thanks to SPS technology, smart card manufacturers are ideally positioned to deliver payment cards worldwide and especially to benefit from the EMV migration in North America.
Smart Packaging Solutions technology has obtained 15 Visa and MasterCard certifications in 2011, a strong growth compared to the 11 certifications the company had already obtained by the end of 2010.
Thanks to SPS EBooster® technology and modular approach, smart card manufacturers are given a full set of options: they can select between major semi conductor vendors, and choose native, JavaCard or Multos based operating systems. This way, smart card manufacturers are able to adapt easily to the complexity of market demand and ensure they are able to deliver banking cards fitting all customer requirements.
With this modular approach, SPS’s customers are ideally positioned to benefit both from mature smart card based banking markets, for instance in Europe, Asia or Latin America, and from upcoming developments such as the United States and China. SPS platforms are used by major smart card manufacturers present on American and Canadian markets.
“These certifications demonstrate our solutions are easily integrated by smart card manufacturers, bringing them recognition by MasterCard and Visa. The flexibility brought by the EBooster® approach allows our customers to adapt thoroughly to market demand,” said Ivan Peytavin, head of sales for North America.
SPS EBooster® technology allows smart card manufacturers of all sizes to deliver high-performance dual technology cards to financial institutions issuing banking cards. SPS platform consists in a micro-module with contacts for EMV contact transactions integrating a small antenna, and an inlay with a full card size antenna, coupled with the small antenna, allowing an efficient communication in contactless mode between the card and the reader. This way, and because there is no physical connection between both antennas, cards are highly reliable, and even allow five lines of embossing in the ISO-defined area. Thanks to the EBooster® technology, smart card vendors are able to deliver dual technology contact & contactless cards without costly investments in their production line.
They can easily integrate a stable process that guarantees high yield rates for their dual interface card embedding process.
Smart Packaging Solutions is present at Cartes in North America trade show, in Las Vegas, NV, on March 5–7. Come and visit us on booth #529.
With more than 20 years of experience in the field of smart card technologies, Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, SPS employs 100 people. The company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at www.s-p-s.com.
Olivier BRUNET, Product director, SPS, email@example.com, tel: +33 4 42 53 84 44
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