Access-IS is becoming HID Global
In August 2020, HID Global acquired Access-IS. As part of the integration process, we are taking an important step by
Nick Schooler2023-03-13T14:08:06-07:00Categories: Industry News|Tags: Access-IS, bor, Border Control, eID, ePassport, HID, Passport, Smart Card|
In August 2020, HID Global acquired Access-IS. As part of the integration process, we are taking an important step by
Nick Schooler2023-03-13T14:08:37-07:00Categories: Industry News|Tags: Applet, Biometrics, Cryptovision, eDriver Licenses, eID, EMV, ePassport, GlobalPlatform, Infineon, Java Card, SECORA|
Munich, Germany – 14 November 2019 – Electronic identification documents (eID) are high in demand worldwide. To address the
Nick Schooler2023-03-13T14:16:01-07:00Categories: Industry News|Tags: Android, Biometrics, eID, ePassport, iOS, MFA, Mobile Biometric Enrollment, Mobile Biometrics, Mobile Tablet, Multi-Factor Authentication, NFC, Physical Access Control, SDK|
LONG BEACH, New York, Oct. 28, 2019 /PRNewswire/ -- Ipsidy Inc., a provider of an Identity as a Service (IDaaS) platform and
Nick Schooler2023-03-13T14:16:35-07:00Categories: Industry News|Tags: eID, Gemalto, Match-On-Card, MOC, PKI|
Amsterdam, June 5, 2013Â -Â Gemalto (Euronext NL0000400653 GTO, the world leader in digital security, will supply the Government Printing Works (GPW)
Nick Schooler2023-03-13T14:16:59-07:00Categories: Industry News|Tags: eID, ePassport, ID Card, Smart Card|
Berlin/Baghdad, September 25, 2018 – Together with the Iraqi Ministry of Interior, world-leading identity solutions provider Veridos is building a
Nick Schooler2023-03-13T14:26:00-07:00Categories: Industry News|Tags: eID, ePassport, IoT, JCOP4, NXP, P71, PUF, Secure Element, Smart Card, SmartMX, SmartMX3|
EINDHOVEN, Netherlands, June 27, 2017 -- NXP Semiconductors N.V. (NASDAQ:NXPI) today unveiled its 3rd generation SmartMX platform built for
Nick Schooler2023-03-13T14:26:07-07:00Categories: Industry News|Tags: Biometrics, eID, ePassport, JCOP, JCOP3, NFC, NXP, Smart Card, SmartMX, SmartMX2|
EINDHOVEN, The Netherlands, May 25, 2017 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI) today announced that the Ecuadorian Government has
Nick Schooler2023-03-13T14:26:42-07:00Categories: Industry News|Tags: eID, ePassport, NXP, P60, PUF, Smart Card, SmartMX, SmartMX2|
Sunnyvale, November 16, 2016:  Intrinsic-ID announces that it’s SRAM PUF- (Physical Unclonable Functions) technology is embedded within NXP® Semiconductor’s SmartMX2
Nick Schooler2023-03-13T14:26:45-07:00Categories: Industry News|Tags: DESFire, eID, ePassport, Java Card, JCOP, JCOP3, MIFARE, NXP, Physical Unclonable Function, PUF, Secure Element, SEED, Smart Card, SmartMX, SmartMX2|
EINDHOVEN, Netherlands, Sept. 29, 2016 -- NXP Semiconductors N.V. (NASDAQ:NXPI) today unveiled its next generation of SmartMX2 P60 Step-Up!
Nick Schooler2023-03-13T14:27:00-07:00Categories: Industry News|Tags: Biometrics, eID, ePassport, ICAO, NXP, SmartMX, SmartMX2|
EINDHOVEN, Netherlands, Aug. 09, 2016 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI) today announced that The Civil Status and Passports Department (CSPD) in Jordan has chosen NXP’s secure SmartMX2