Infineon’s Secora™ ID accelerates eID project execution
Munich, Germany – 14 November 2019 – Electronic identification documents (eID) are high in demand worldwide. To address the
Nick Schooler2020-01-17T13:40:20-08:00Categories: Industry News|Tags: Applet, Biometrics, Cryptovision, eDriver Licenses, eID, EMV, ePassport, GlobalPlatform, Infineon, Java Card, SECORA|
Munich, Germany – 14 November 2019 – Electronic identification documents (eID) are high in demand worldwide. To address the
Nick Schooler2020-02-27T17:43:25-08:00Categories: Industry News|Tags: Android, Biometrics, eID, ePassport, iOS, MFA, Mobile Biometric Enrollment, Mobile Biometrics, Mobile Tablet, Multi-Factor Authentication, NFC, Physical Access Control, SDK|
LONG BEACH, New York, Oct. 28, 2019 /PRNewswire/ -- Ipsidy Inc., a provider of an Identity as a Service (IDaaS) platform and
Nick Schooler2019-12-04T10:32:02-08:00Categories: Industry News|Tags: eID, Gemalto, Match-On-Card, MOC, PKI|
Amsterdam, June 5, 2013 - Gemalto (Euronext NL0000400653 GTO, the world leader in digital security, will supply the Government Printing Works (GPW)
Nick Schooler2019-12-04T10:32:51-08:00Categories: Industry News|Tags: eID, ePassport, IoT, JCOP4, NXP, P71, PUF, Secure Element, Smart Card, SmartMX, SmartMX3|
EINDHOVEN, Netherlands, June 27, 2017 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI) today unveiled its 3rd generation SmartMX platform
Nick Schooler2019-12-04T10:32:53-08:00Categories: Industry News|Tags: Biometrics, eID, ePassport, JCOP, JCOP3, NFC, NXP, Smart Card, SmartMX, SmartMX2|
EINDHOVEN, The Netherlands, May 25, 2017 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI) today announced that the Ecuadorian Government has
Nick Schooler2019-12-04T10:32:58-08:00Categories: Industry News|Tags: eID, ePassport, NXP, P60, PUF, Smart Card, SmartMX, SmartMX2|
Sunnyvale, November 16, 2016: Intrinsic-ID announces that it’s SRAM PUF- (Physical Unclonable Functions) technology is embedded within NXP® Semiconductor’s SmartMX2
Nick Schooler2019-12-04T10:32:59-08:00Categories: Industry News|Tags: Desfire, eID, ePassport, Java Card, JCOP, JCOP3, MIFARE, NXP, Secure Element, Smart Card, SmartMX, SmartMX2|
EINDHOVEN, Netherlands, Sept. 29, 2016 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI) today unveiled its next generation of SmartMX2 P60 Step-Up! that offers customers unique
Nick Schooler2019-12-04T10:33:03-08:00Categories: Industry News|Tags: Biometrics, eID, ePassport, ICAO, NXP, SmartMX, SmartMX2|
EINDHOVEN, Netherlands, Aug. 09, 2016 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI) today announced that The Civil Status and Passports Department (CSPD) in Jordan has chosen NXP’s secure SmartMX2
Nick Schooler2019-12-04T10:33:21-08:00Categories: Industry News|Tags: Dual-Interface, eID, ePassport, JCOP3, NXP, Physical Access Control, Smart Card, SmartMX, SmartMX2|
EINDHOVEN, THE NETHERLANDS--(Marketwire - Oct 25, 2012) - NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that the world's largest bank, the